SAC solder paste with carbon nanotubes. Part II: carbon nanotubes’ effect on solder joints’ mechanical properties and microstructure-Reference-Cited by-同舟云学术

SAC solder paste with carbon nanotubes. Part II: carbon nanotubes’ effect on solder joints’ mechanical properties and microstructure

Published:2013-09-13 Issue:4 Volume:25 Page:195-208
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Bukat Krystyna,Sitek Janusz,Koscielski Marek,Niedzwiedz Wojciech,Mlozniak Anna,Jakubowska Malgorzata

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference32 articles.

1. Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles

2. Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

3. SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

4. Surface finish effect on reliability of SAC 305 soldered chip resistors

5. Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

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