Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. Capillary Underfill Flow Simulation and Experimental Study for Solder Mask Opening and Trace Distribution in Bump Layout Design;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. System-in-Package (SiP);Semiconductor Advanced Packaging;2021
4. Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-03
5. Flip Chip Technology Versus FOWLP;Fan-Out Wafer-Level Packaging;2018