Special Issue on lead-free and lead-bearing solders-Reference-Cited by-同舟云学术

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Special Issue on lead-free and lead-bearing solders

Published:2002-12 Issue:3 Volume:14 Page:
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Introduction;Lead Free Solder;2011-09-13

2. Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints;Journal of Electronic Materials;2004-10

3. Lead-Free Solder Materials: Design For Reliability;Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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