Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications-Reference-Cited by-同舟云学术

Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications

Published:2005-03 Issue:1 Volume:17 Page:24-32
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Jackson G.J.,Hendriksen M.W.,Kay R.W.,Desmulliez M.,Durairaj R.K.,Ekere N.N.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Engineering solder paste performance through controlled stress rheology analysis

2. Critical factors affecting paste flow during the stencil printing of solder paste

3. Correlation of solder paste rheology with computational simulations of the stencil printing process

4. Conductive adhesives for SMT and potential applications

5. Rheological characterization of solder pastes for surface mount applications

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