1. Morris, J. and O'Keefe, M.J. (2003), “Equipment impacts of lead‐free wave soldering”, Proceedings of the Technical Conference of IPC Printed Circuits Expo (APEX 2003), Anaheim, CA, pp. 1‐9.
2. EC (2003), Official Journal of the European Union, February 13, pp. L 37/19‐L37/23, L 37/24‐L37/38.
3. Shoji, Y., Uchida, S. and Ariga, T. (1980), “Effect of specimen size on dissolution of copper in molten tin under forced convection”, Trans. Japan Weld. Soc., Vol. 11 No. 2, pp. 148‐55.
4. Dissolution of solid copper cylinder in molten tin-lead alloys under dynamic conditions
5. Toward defects-free in lead-free micro-soldering