1. Step aside QFP - here comes OMPAC
2. 2Freyman, B. and Pennisi, R.‘Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics’,Proceedings Electronic Components and Technology Conference, pp.176‐182 (1991).
3. 3Yip, W. Y and Tsai, C. T,‘Electrical Performance of an Overmolded Pad Array Carrier (OMPAC)’,Proceedings International Electronics Packaging Conference, pp.731‐739 (1993).
4. 4 Hawkins, G., Ganesan, G., Lewis, G andBerg, H.‘The PBGA: A Systematic Study of Moisture Resistance’, Proceedings International Electronics Packaging Conference, pp.588‐602 (1994).
5. 5Miles, B. and Freyman, B.‘The Elimination of the Popcorn Phenomenon in Overmolded Plastic Pad Array Carriers (OMPAC)’, Proceedings International Electronics Packaging Conference, pp.605‐614 (1992).