Mechanical properties of Pb/Sn Pb/In and Sn‐In solders

Author:

Kinzy Jones W.,Liu Yanqing,Shah Milind,Clarke Robert

Abstract

The mechanical properties of eight solder alloys from the Pb‐Sn‐In‐Ag alloy systems were determined over the temperature range ‐200°C to 100°C, using uniaxial tensile tests, dynamic mechanical analysis (DMA), acoustic pulse methods and dilatometry. In general, the strength and elastic modulus of the alloys studied was inversely dependent on temperature. PbSn, PbIn and SnIn alloys were observed to turn superplastic with elongations over 100 per cent at temperatures of 50°C or above. The Pb‐based and In‐Sn eutectic solders possessed superplasticity at temperatures greater than 50°C. From these results, deformation and fracture processes are reviewed, and the appropriate fracture mechanism is proposed.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference11 articles.

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2. 2Zhuge, R., Jones, W.K. and Maganti, S.S., “Stress analysis of multilayer multichip module (MCM‐D) structures using the series solution of elasticity theory”, Proceedings of the International Microelectronics Symposium, ISHM, Japan, 1992.

3. 3Gonzalez, G.L., Liu, Y.Q. and Maganti, S.S., “Physical properties of low temperature solders and die attach materials”, Proceedings of Southcon 95, Ft Lauderdale, Fl, 1995.

4. 4Morgan, H.S., “Thermal stresses in layered electrical assemblies bonded with solder”, Transactions of ASME, Journal of Electronic Packaging, Vol. 113, December 1991, pp. 350‐4.

5. 5Frear, D., Grivas, D. and Morris, J.W. Jr, “A microstuctural study of the thermal fatigue failures of 60Sn‐40Pb Solder Joints”, Journal of Electronic Mat., Vol. 17, 1988, p. 171.

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