The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs

Author:

Skwarek Agata,Ptak Przemysław Piotr,Górecki Krzysztof,Witek Krzysztof,Illés Balázs

Abstract

Purpose This paper aims to present the results of investigations that show the influence of ZnO composite soldering paste on the optical and thermal parameters of power light-emitting diodes (LEDs). Design/methodology/approach ZnO nanocomposite solder alloys were produced via the ball milling process from the solder paste Sn99Ag0.3Cu0.7 (SACX0307) and 1.0 wt% of ZnO nanoparticle reinforcements with different primary particle sizes (200 nm, 100 nm and 50 nm). Power LEDs were soldered onto a metal core printed circuit board. A self-designed LED test system was used to measure the thermal and optical characteristics of the LEDs. Findings The influence of the soldering paste on the thermal and optical parameters of LEDs was observed. In all solder alloys, ZnO ceramic reinforcement, at a level of 1 wt%, increased the thermal parameters of LEDs and decreased their luminous efficiency. Thermal resistance values were10% higher, and junction temperature change over ambient temperature was 20% higher for the samples soldered with composite solder pastes than the reference sample. At the same time, luminous efficiency dropped by 32%. Originality/value The results prove that ZnO ceramic reinforcement of solder paste influences the thermal properties of solder joints. As was proven, the quality of the solder joints influences the whole assembly.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. Alphacool (2020), “Alphacool company site”, available online: www.alphacool.com/ (accessed 22 Jan 2020).

2. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly;Soldering & Surface Mount Technology,2018

3. LED light emission as a function of thermal conditions,2008

4. Light emitting diodes reliability review;Microelectronics Reliability,2012

5. X-ray inspection and six-sigma in analysis of LED thermal pad coverage;Soldering & Surface Mount Technology,2017

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