Thermal time constants of various substrates of integrated circuits

Abstract

The main goal of the work is to show how the kind of substrate and heat sink of integrated circuit or system influences the thermal dynamics of the circuit or system. The investigation leads to the solution of an unsteady state thermal model with analytic method and determination of the thermal time constants of various active and passive substrates and heat sinks. The results show that cheaper materials without any losses of thermal dynamics can replace expensive substrates and heat sinks. Theoretical procedure carried out step by step presents the way of unsteady state temperature computation with analytic method. It can be helpful for determination of the temperature of the chip during unsteady state in any point of the chip, average temperature and thermal time constant of the substrate.