Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests-Reference-Cited by-同舟云学术

Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

Published:2011-06-28 Issue:3 Volume:23 Page:161-167
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Li Jue,Xu Hongbo,Hokka Jussi,Mattila Toni T.,Chen Hongtao,Paulasto‐Kröckel Mervi

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures

2. Clech, J.‐P. (2005), “Acceleration factors and thermal cycling test efficiency for lead‐free Sn‐Ag‐Cu assemblies”,Proceedings of the 2005 SMTA International Conference, Chicago, IL, USA, pp. 902‐17.

3. Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

4. The impact of thermal cycling regime on the shear strength of lead‐free solder joints

5. Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

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