Author:
Zou Hao,Xie Fang,Du Bo,Kavithaa G.
Abstract
Purpose
The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.
Design/methodology/approach
In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.
Findings
It was found that inverter types highly affect the solder joint health during its nominal operating.
Originality/value
The authors confirm the originality of this paper.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference43 articles.
1. A comprehensive study on variations of discrete IGBT characteristics due to package degradation triggered by thermal stress,2016
2. Lifetime estimation of discrete IGBT devices based on Gaussian process;IEEE Transactions on Industry Applications,2018
3. Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method;Finite Elements in Analysis and Design,2015
4. A lumped thermal model including thermal coupling and thermal boundary conditions for High-Power IGBT modules;IEEE Transactions on Power Electronics,2018
5. Model for power cycling lifetime of IGBT modules - various factors influencing lifetime,2008
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Design and analysis of electric spring based on battery-less current-source inverter;COMPEL - The international journal for computation and mathematics in electrical and electronic engineering;2024-02-15
2. Correntropy-based Aligned Predictor for Degradation Prognosis;2021 CAA Symposium on Fault Detection, Supervision, and Safety for Technical Processes (SAFEPROCESS);2021-12-17