Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies-Reference-Cited by-同舟云学术

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Published:2020-10-14 Issue:1 Volume:33 Page:1-7
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:SSMT

Author:

Gao Yang,Wang Fuwei,Ding Shaohu,Yang Bin,Liu Lin,Salmani Mohammad

Abstract

Purpose This study aims to investigate the vibration effects on ball grid array lifetime. Design/methodology/approach Several finite element method simulations and experiments were performed. Findings An optimized circuit configuration was found. Originality/value The originality of paper is confirmed by authors.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference30 articles.

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5. Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications,2018

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