Retardation of Massive Spalling by Palladium Layer Addition to Surface Finish-Reference-Cited by-同舟云学术

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Retardation of Massive Spalling by Palladium Layer Addition to Surface Finish

Published:2010-11-25 Issue:11 Volume:48 Page:1041-1046
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:
Short-container-title:Kor. J. Met. Mater.

Author:

Lee Dae-Hyun,Chung Bo-Mook,Huh Joo-Youl

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modelling and Simulation,Electronic, Optical and Magnetic Materials

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process;Journal of Electronic Materials;2012-11-06

2. Effect of Intermetallic Compounds Growth Characteristics on the Shear Strength of Cu pillar/Sn-3.5Ag Microbump for a 3-D Stacked IC Package;Korean Journal of Metals and Materials;2012-10-05

3. Effect of Interfacial Microstructures on the Bonding Strength of Sn–3.0Ag–0.5Cu Pb-Free Solder Bump;Japanese Journal of Applied Physics;2012-05-21

4. Effects of Temperature and Current Stressing on the Intermetallic Compounds Growth Characteristics of Cu Pillar/Sn–3.5Ag Microbump;Japanese Journal of Applied Physics;2012-05-21

5. Effect of Interfacial Microstructures on the Bonding Strength of Sn–3.0Ag–0.5Cu Pb-Free Solder Bump;Japanese Journal of Applied Physics;2012-05-01

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