Synthesis of Three-Dimensionally Interconnected Hexagonal Boron Nitride Networked Cu-Ni Composite

Abstract

A three-dimensionally interconnected hexagonal boron nitride (3Di-hBN) networked Cu-Ni (3DihBN-Cu-Ni) composite was successfully synthesized in situ using a simple two-step process which involved the compaction of mixed Cu-Ni powders (70 wt.% Cu and 30 wt.% Ni) into a disc followed by metal-organic chemical vapor deposition (MOCVD) at 1000 ^oC. During MOCVD, the Cu-Ni alloy grains acted as a template for the growth of hexagonal boron nitride (hBN) while decaborane and ammonia were used as precursors for boron and nitrogen, respectively. Boron and nitrogen atoms diffused into the Cu-Ni solution during the MOCVD process and precipitated out along the Cu-Ni interfaces upon cooling, resulting in the formation of the 3Di hBN-Cu-Ni composite. Energy-dispersive spectroscopic analysis confirmed the presence of boron and nitrogen atoms at the interfaces of Cu-Ni alloy grains. Optical microscopy examination indicated that there was a minimum amount of bulk hBN at a certain compaction pressure (280 MPa) and sintering time (30 min). Scanning electron microscopy and transmission electron microscopy revealed that an interconnected network of hBN layers surrounding the Cu-Ni grains developed in the 3Di-hBN-Cu-Ni composite. This 3Di-hBN network is expected to enhance the mechanical, thermal, and chemical properties of the 3Di-hBN-Cu-Ni composite. Moreover, the foam-like 3Di-hBN extracted from 3Di-hBN-Cu-Ni composite could have further applications in the fields of biomedicine and energy storage.