A Study on the Interrelationship between the Microstructural Features and the Elevated Temperature Strength of Multicomponent Al-Si-Cu-Ni Casting Alloys

Author:

Jo Min-Su,Cho Young-Hee,Lee Jung-Moo,Kim Soo-Bae,Kim Su-Hyeon,Jang Jae-il

Abstract

The elevated temperature strength of multicomponent Al-Si alloys is greatly affected by the volume fraction and the interconnectivity of hard phases formed upon solidification. In the present investigation, such influences were examined for two Al-Si-Cu-Ni alloys with different total volume fractions of hard phases. To control the microstructural features related to the size of the phase, the specimens were prepared with and without ultrasonic melt treatment (UST) at different cooling rates. The microstructures of the alloys were composed of primary Si, eutectic Si, (Al,Si)3(Zr,Ni,Fe), Al9FeNi and Al3(Cu,Ni)2 phases. The microstructural features, such as the size and aspect ratio of each phase, changed with UST and cooling rate, and accordingly, the elevated temperature strength at 350 oC was changed. The alloy with a high volume fraction of about 30 vol.% exhibited increased elevated temperature strength at 350 oC when ultrasonic melt treated, and the alloy having a volume fraction as low as about 18 vol.% exhibited the opposite results. Considering the microstructural features of the multi-component Al-Si alloy, a hexagonal shear-lag model was suggested, based on the well-known shearlag model proposed by Nardone and Prewo (Scr. Metall. 20;1986:43-48). Using the 2-D microstructural factors such as the size, aspect ratio of the phase and secondary dendrite arm spacing, the elevated temperature strength was calculated and compared with the measured value. Based on the hexagonal shear-lag model, the influence of microstructural factors on the elevated temperature strength was discussed for multi-component Al-Si-Cu-Ni alloys.

Funder

Ministry of Trade, Industry and Energy

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

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