液相拡散接合における粒子構造が接合強度に及ぼす影響
Author:
Affiliation:
1. Manufacturing Innovation Division, Panasonic Holdings Corporation
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films
Link
https://www.jstage.jst.go.jp/article/jspmee/12/5/12_238/_pdf
Reference7 articles.
1. 1) T. Funaki, J. Balda, J. Junghans, A. Kashyap, F.D. Barlow, H.A. Mantooth, T. Kimoto and T. Hikihara: “SiC JFET dc characteristics under extremely high ambient temperatures”, IEICE Electronics Express, 1-17 (2004), 523-527.
2. 2) J. Wang, S. Xue, P. Zhang, P. Zhai and Y. Tao: “The reliability of lead-free solder joint subjected to special environment: a review”, Journal of Materials Science: Materials in Electronics, 30-10 (2019), 9065-9086.
3. 3) O. Mokhtari and H. Nishikawa: “Transient liquid phase bonding of Sn–Bi solder with added Cu particles”, Journal of Materials Science: Materials in Electronics, 27-5 (2016), 4232-4244.
4. 4) ASM International: “ASM Alloy Phase Diagram Database”, CDROM (2008), Cu-Sn.
5. 5) K. Fukuchi, K. Oguchi, K. Kurosawa, A. Takita and A. Furusawa: “Inelastic Deformation of Cu3Sn Bulk Specimen Under Micro- Indentation Testing and Its Temperature Dependency”, JSME annual meeting (2020), J03125. (in Japanese)
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