Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation

Abstract

AbstractThe comparison of one- and three-dimensional cure simulation of thick thermoset matrix laminates was conducted in this study. The applicable conditions of one-dimensional cure simulation were investigated. The transient heat conduction equation coupled to the cure kinetics was solved numerically using one- and three-dimensional finite element analysis. The evolution of temperature and degree of cure of the laminates during the curing process obtained by the simulation agreed well with the published experimental results. The results indicate that a wider one-dimensional analysis applicable region around the center point will be obtained in the laminate with a higher span-to-thickness ratio and in a less anisotropic material system. In the applicable region, the accuracy of the one-dimensional cure simulation can satisfy the engineering request and save the computational cost. While beyond the region, there is a steep increase in deviation of the one- and three-dimensional simulation results.