A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges

Abstract

Abstract Microchannel heat sink (MCHS) is an advanced cooling technique to fulfil the cooling demand for electronic devices installed with high-power integrated circuit packages (microchips). Various microchannel designs have been innovated to improve the heat transfer performance in an MCHS. Specifically, the utilisation of nanotechnology in the form of nanofluid in an MCHS attracted the attention of researchers because of considerable enhancement of thermal conductivity in nanofluid even at a low nanoparticle concentration. However, a high-pressure drop was the main limitation as it controls the MCHS performance resulted from heat transfer augmentation. Therefore, this study aimed to critically summarise the challenges and limitations of both single and hybrid passive methods of MCHS. Furthermore, the performance of nanofluid as a coolant in the MCHS as affected by the type and concentration of nanoparticle and the type of base fluid was reviewed systematically. The review indicated that the hybrid MCHS provides a better cooling performance than MCHS with the single passive method as the former results in a higher heat transfer rate with minimal pressure drop penalty. Besides that, further heat transfer performance can be enhanced by dispersing aluminium dioxide (Al2O3) nanoparticles with a concentration of less than 2.0% (v/v) in the water-based coolant.