Preparation of solution-processable colorless polyamide-imides with extremely low thermal expansion coefficients through an in-situ silylation method for potential space optical applications

Author:

Wang Song1,Yang Guangjie2,Wu Shibin1,Ren Ge1,Yang Wei1,Liu Xikui2

Affiliation:

1. 1Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, P.R. China

2. 2College of Polymer Science and Engineering, Sichuan University, Chengdu, P.R. China

Abstract

AbstractSeveral tough and flexible fluorinated polyamide-imide films were prepared from trimellitic anhydride chloride and 2,2′-bis(trifluoromethyl)benzidine through a facile one-pot in-situ silylation method. By incorporating fluorinated side groups, the solubility of the prepared polyamide-imide was greatly enhanced. Meanwhile, due to their linear chain configuration and the existence of hydrogen bonding, the prepared polyamide-imide films revealed high tensile strength, high tensile modulus, high glass transition temperature (Tg) and most interestingly, very low coefficient of thermal expansion (CTE) of 11 ppm/°C. Copolymerization with pyromellitic dianhydride (PMDA) led to an extremely low CTE of 4 ppm/°C which should be among the lowest values available for soluble polyamide-imides. The optical homogeneity and stress homogeneity of the obtained polyamide-imide films were also tested. After non-contact with substance and thermal treatment at 300°C, they revealed a better optical homogeneity and stress homogeneity than that of the commercially available Kapton polyimide (PI) films, with a PV value of 0.915 λ and RMS value of 0.163 λ. Thus, these colorless and soluble polyamide-imide films simultaneously possessing promising optical imaging performance are good candidates as novel diffractive membrane optical system architectures.

Publisher

Walter de Gruyter GmbH

Subject

Polymers and Plastics,Physical and Theoretical Chemistry,General Chemical Engineering

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