The effect of high-current pulsed electron beam modification on the surface wetting property of polyamide 6

Author:

Chen Yuan Fang12,Zhang Tao1,Tang Meng1,Xie Ding1,Long Qian1,Li Cai Yun1

Affiliation:

1. 1College of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China

2. 2Chongqing Key Laboratory of Mould Technology, Chongqing 400054, China

Abstract

AbstractThis study demonstrates that different modification pulse voltages affect the wetting property of the surface of polyamide 6 (PA6) with a certain regularity. Broadly, the hydrophilic property of PA6’s surface increases with increasing pulsed voltage. Based on scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) analysis, this paper discusses the mechanism by which high current pulsed electron beam (HCPEB) etching modification influences the surface wettability of PA6. Within a certain range below 28 kV, this effect is caused by an increase of in surface roughness due to HCPEB bombardment of the surface. Within a certain range above 28 kV, HCPEB changes the surface morphology, resulting in changes to the wetting property. Furthermore, by using various pulsed voltages to modify the PA6 surface, this study investigated the ability of the Wenzel model to explain changes in the water contact angle and wetting property of PA6’s surface.

Publisher

Walter de Gruyter GmbH

Subject

Polymers and Plastics,Physical and Theoretical Chemistry,General Chemical Engineering

Reference28 articles.

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