A universal metasurface transfer technique for heterogeneous integration

Author:

Zhang Xu1ORCID,Cai Haogang2ORCID,Daqiqeh Rezaei Soroosh3ORCID,Rosenmann Daniel4,Lopez Daniel3

Affiliation:

1. Department of Electrical and Computer Engineering , Carnegie Mellon University , Pittsburgh , PA 15213 , USA

2. Department Tech4Health Institute and Department of Radiology, NYU Langone Health , New York , NY , 10016, USA

3. Department of Electrical Engineering & Materials Research Institute , The Pennsylvania State University , University Park , PA , 16802 , USA

4. Center for Nanoscale Materials, Argonne National Laboratory , Lemont , IL, 60439, USA

Abstract

Abstract Metasurfaces offer a versatile platform for engineering the wavefront of light using nanostructures with subwavelength dimensions and hold great promise for dramatically miniaturizing conventional optical elements due to their small footprint and broad functionality. However, metasurfaces so far have been mainly demonstrated on bulky and planar substrates that are often orders of magnitude thicker than the metasurface itself. Conventional substrates not only nullify the reduced footprint advantage of metasurfaces, but also limit their application scenarios. The bulk substrate also determines the metasurface dielectric environment, with potentially undesired optical effects that undermine the optical performance. Here we develop a universal polymer-assisted transfer technique to tackle this challenge by decoupling the substrate employed on the fabrication of metasurfaces from that used for the target application. As an example, Huygens’ metasurfaces with 120 nm thickness in the visible range (532 nm) are demonstrated to be transferred onto a 100 nm thick freestanding SiN x membrane while maintaining excellent structural integrity and optical performance of diffraction-limited focusing. This transfer method not only enables the thinnest dielectric metalens to the best of our knowledge, but also opens up new opportunities in integrating cascaded and multilayer metasurfaces, as well as the heterogeneous integration with nonconventional substrates and various electronic/photonic devices.

Funder

The Pennsylvania Infrastructure Technology Alliance

Argonne National Laboratory’s Laboratory Directed Research and Development

U.S. National Institute of General Medical Sciences

Publisher

Walter de Gruyter GmbH

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials,Biotechnology

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