Enhancing thermal conductivity and balancing mechanical properties of 3D-printed iPP/HDPE-based dielectric composites via the introduction of hybrid fillers and tailored crystalline structure-Reference-Cited by-同舟云学术

Enhancing thermal conductivity and balancing mechanical properties of 3D-printed iPP/HDPE-based dielectric composites via the introduction of hybrid fillers and tailored crystalline structure

Published:2023-07-11 Issue:1 Volume:18 Page:
ISSN:1745-2759
Container-title:Virtual and Physical Prototyping
language:en
Short-container-title:Virtual and Physical Prototyping

Author:

Yang Tao¹,Leng Jie¹,Hu Jiewei¹,Wang Pengbo¹,Edeleva Mariya²,Cardon Ludwig²,Yan Zheng¹,Wang Tao¹,Zhang Jie¹^ORCID

Affiliation:

1. College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, People’s Republic of China

2. Centre for Polymer and Material Technologies, Department of Materials, Textiles and Chemical Engineering, Faculty of Engineering and Architecture, Ghent University, Zwijnaarde, Belgium

Funder

State Key Laboratory of Polymer Materials Engineering

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Computer Graphics and Computer-Aided Design,Modeling and Simulation,Signal Processing

Link

https://www.tandfonline.com/doi/pdf/10.1080/17452759.2023.2230215

Reference82 articles.

1. Effects of aluminium nitride inclusions on thermal and electrical properties of epoxy and polypropylene: An experimental investigation

2. Investigation of Thermal and Dielectric Properties of Epoxy Based Hybrid Composites for Microelectronics Applications

3. Damping behavior of carbon nanotube reinforced aluminum oxide coatings by nanomechanical dynamic modulus mapping

4. Crystallization kinetics of poly(lactic acid)-talc composites

5. The synergistic effects of the micro-BN and nano-Al2O3 in micro-nano composites on enhancing the thermal conductivity for insulating epoxy resin

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