EFFECTS OF NONIONIC SURFACTANTS ON PERFORMANCE OF COPPER CHEMICAL MECHANICAL POLISHING
Author:
Publisher
Informa UK Limited
Subject
General Chemical Engineering,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/00986440500265901
Reference12 articles.
1. Role of interaction forces in controlling the stability and polishing performance of CMP slurries
2. Enhanced Tungsten Chemical Mechanical Polishing Using Stable Alumina Slurries
3. Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects
4. Effect of Chemicals and Slurry Particles on Chemical Mechamical Polishing of Polyimide
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