Mainshock-Aftershock Ground Motion Features and Their Influence in Building's Seismic Response
Author:
Publisher
Informa UK Limited
Subject
Geotechnical Engineering and Engineering Geology,Building and Construction,Civil and Structural Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference29 articles.
1. Asperities, barriers, characteristic earthquakes and strong motion prediction
2. The effects of repeated earthquake ground motions on the non-linear response of SDOF systems
3. Source characteristics of earthquakes in the Michoacan seismic gap in Mexico
4. Dalguer, L. A. and Irikura, K. Dynamic source effect of dip-slip earthquake on strong ground motion. Proc. of the 2ndACES (APEC Cooperation for Earthquake Simulation) Workshop. Tokyo-Hakone, Japan. October 15–20.
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