Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer
Author:
Publisher
Informa UK Limited
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/01457632.2015.1097753
Reference13 articles.
1. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
2. High-performance heat sinking for VLSI
3. Interlayer cooling potential in vertically integrated packages
4. Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies
5. Laminar Flow Across a Bank of Low Aspect Ratio Micro Pin Fins
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09
2. Modeling of the RF Coaxial TSV Configuration Inside the Silicon Interposer With Embedded Cooling Cavity;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-01
3. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05
4. TSV Technology and High-Energy Heavy Ions Radiation Impact Review;Electronics;2018-07-13
5. Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading;Journal of Electronic Materials;2017-05-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3