A study of diffusion in thin Cu/Pb films using Auger electron spectroscopy-Reference-Cited by-同舟云学术

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A study of diffusion in thin Cu/Pb films using Auger electron spectroscopy

Published:1973-06 Issue:6 Volume:27 Page:1467-1474
ISSN:0031-8086
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Wilson J. M.

Publisher

Informa UK Limited

Link

http://www.tandfonline.com/doi/pdf/10.1080/14786437308226901

Reference13 articles.

1. Interstitial Diffusion of Copper and Silver in Lead

2. Auger electron spectroscopy and its application to surface studies

3. Constitution of Binary Alloys

4. Auger Electron Spectroscopy of fcc Metal Surfaces

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism;Journal of Electronic Materials;2019-11-13

2. Surface composition of alloys;Progress in Surface Science;1981-01

3. Measurement of grain‐boundary diffusion at low temperatures by the surface accumulation method. I. Method and analysis;Journal of Applied Physics;1979-03

4. On a possible temperature dependence of the activation energy for grain boundary diffusion in metals;Scripta Metallurgica;1978-08

5. Diffusion of Ag in Au thin films studied by auger spectroscopy;Thin Solid Films;1976-05

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