Subject
Electrical and Electronic Engineering
Cited by
38 articles.
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1. Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23
2. Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz;IEEE Transactions on Signal and Power Integrity;2023
3. Efficient Crosstalk Analysis of Differential Links on Printed Circuit Boards Up to 100 GHz;IEEE Transactions on Electromagnetic Compatibility;2019-12
4. Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-12
5. Energy-Aware Signal Integrity Analysis for High-Speed PCB Links;IEEE Transactions on Electromagnetic Compatibility;2015-10