Modelling and analysis of the electrostatic adhesion performance considering a rotary disturbance between the electrode panel and the attachment substrate-Reference-Cited by-同舟云学术

Modelling and analysis of the electrostatic adhesion performance considering a rotary disturbance between the electrode panel and the attachment substrate

Published:2016-04-29 Issue:21 Volume:30 Page:2301-2315
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Chen Rui¹,Huang Yao¹,Tang Qian¹,Bai Long¹

Affiliation:

1. State Key Laboratory of Mechanical Transmissions, Chongqing University, Chongqing, P.R. China

Funder

National Natural Science Foundation of China

The Basic and Advanced Research Project of Chongqing

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2016.1180949

Reference22 articles.

1. Fundamental study of an electrostatic chuck for silicon wafer handling

2. Workpiece retention during machine processing

3. Modeling and analysis of electrostatic force for robot handling of fabric materials

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