Operating mechanism of pulsating heat pipe with different wettability from the perspective of thermo-hydrodynamic characteristics of vapor–liquid interface region-Reference-Cited by-同舟云学术

Operating mechanism of pulsating heat pipe with different wettability from the perspective of thermo-hydrodynamic characteristics of vapor–liquid interface region

Published:2024-03-29 Issue: Volume: Page:1-26
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Yan Yuhao¹,Liu Ying¹,Wu Xilei¹,Yang Jialiang¹,Ye Gongran¹,Guo Zhikai²,Han Xiaohong¹^ORCID

Affiliation:

1. Zhejiang Provincial Key Laboratory of Refrigeration and Cryogenic Technology, Institute of Refrigeration and Cryogenics, Zhejiang University, Hangzhou, P.R. China

2. State Key Lab for Fluorine Greenhouse Gases Replacement and Control Treatment, Zhejiang Research Institute of Chemical Industry, Hangzhou, P.R. China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Zhejiang Province

Open Project of Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/10407782.2024.2332473

Reference56 articles.

1. A review of heat pipe technology for foldable electronic devices

2. Effect of filling ratio, number of loops, and transverse distance on the performance of pulsating heat pipe in a microchannel heat sink

3. H. Akachi “Structure of a heat pipe ” U.S. Patent No. 4 921 041 1990.

4. Experimental study on a three-dimensional pulsating heat pipe with tandem tapered nozzles

5. A critical review of traditional and emerging techniques and fluids for electronics cooling

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analytical modeling of desublimation of a phase change material (PCM) in a porous medium with temperature-dependent volumetric heat sink and convection due to air-mixed vapor;Numerical Heat Transfer, Part A: Applications;2024-06-17