SIMULTANEOUS DOUBLE-SIDE GRINDING OF SILICON WAFERS: A REVIEW AND ANALYSIS OF EXPERIMENTAL INVESTIGATIONS-Reference-Cited by-同舟云学术

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SIMULTANEOUS DOUBLE-SIDE GRINDING OF SILICON WAFERS: A REVIEW AND ANALYSIS OF EXPERIMENTAL INVESTIGATIONS

Published:2009-08-31 Issue:3 Volume:13 Page:285-316
ISSN:1091-0344
Container-title:Machining Science and Technology
language:en
Short-container-title:Machining Science and Technology

Author:

Qin Na,Pei Z. J.,Fisher Graham R.,Liu J.

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/10910340903237673

Reference55 articles.

1. Abrasive Capacity of Thin Film Diamond Structures

2. ASTM ( 2002 ) Standard test method for measuring flatness, thickness, and thickness variation on silicon wafers by automated noncontact scanning, ASTM F~1530.

3. ASTM ( 1992 ) Standard test method for measuring warp and total thickness variation on silicon wafers by noncontact scanning, ASTM F~657.

4. ASTM ( 1997 ) Standard test method for measuring warp on silicon wafers by automated non-contact scanning, ASTM F1390.

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1. Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel;Journal of Physics: Conference Series;2023-08-01

2. Fixed abrasive machining of non-metallic materials;CIRP Annals;2018

3. Study on Ultrasonic Vibration Deep Microspore Drilling Bit Dynamic State;2014 Fifth International Conference on Intelligent Systems Design and Engineering Applications;2014-06

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