Enhanced Thermal Conduction Through Nanostructured Interfaces
Author:
Affiliation:
1. Department of Mechanical Engineering, Stanford University, Stanford, California, USA
2. Department of Materials Science and Engineering, Stanford University, Stanford, California, USA
Funder
Semiconductor Research Corporates
Publisher
Informa UK Limited
Subject
Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Link
https://www.tandfonline.com/doi/pdf/10.1080/15567265.2017.1296910
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