Material removal in grinding sapphire wafers with brazed–diamond pellet plates
Author:
Affiliation:
1. College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, China
2. School of Mechanical and Manufacturing Engineering, Univ New S Wales, Sydney, Australia
Funder
National Natural Science Foundation of China
Natural Science Foundation of Fujian Province
Australian Research Council
Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/10426914.2019.1594260
Reference34 articles.
1. Evaluation of Double-Sided Planetary Grinding Using Diamond Wheels for Sapphire Substrates
2. Process Optimization of Lapping Sapphire Substrate with Fixed Diamond Abrasive Pad
3. Optical Properties Evaluated According to the Different Thickness Sapphire under the Same Polishing Conditions
4. Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw
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