Influence of silver on structural, electrical, mechanical and soldering properties of tin-indium based alloys

Author:

El-bediwi Abu Bakr,El-bahay M. M.

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science,Nuclear and High Energy Physics,Radiation

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Interconnect;Advanced Driver Assistance Systems and Autonomous Vehicles;2022

2. Ag-In-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2021-12-30

3. Low melting point solders based on Sn, Bi, and In elements;Materials Today Advances;2020-12

4. Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy;Journal of Materials Science;2020-04-26

5. GRAIN STRUCTURE OF BISMUTH-TIN ALLOYS, ADDITIONAL DOPING WITH INDIUM;Physical and Chemical Aspects of the Study of Clusters, Nanostructures and Nanomaterials;2018-12-15

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