Three-dimensional steady-state ground heat transfer for multi-zone buildings
Author:
Publisher
Informa UK Limited
Subject
Computer Science Applications,Modeling and Simulation,Building and Construction,Architecture
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference37 articles.
1. Review paper: Earth-contact heat flows: Review and application of design guidance predictions
2. Calculation of the steady-state heat transfer through a slab-on-ground floor
3. EnergyPlus vs DOE-2.1e: The effect of ground coupling on cooling/heating energy requirements of slab-on-grade code houses in four climates of the US
4. Beausoleil-Morrison, I., and G. Mitalas. 1997. “BASESIMP: A Residential-Foundation Heat-Loss Algorithm for Incorporating Into Whole-Building Energy-Analysis Programs.” Proceedings building simulation ’97. Prague, Czech Republic: International Building Performance Simulation Association.
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