The relation between structure changes and thermal expansion in liquid indium-Reference-Cited by-同舟云学术

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The relation between structure changes and thermal expansion in liquid indium

Published:2016-06-21 Issue:2 Volume:55 Page:254-263
ISSN:0031-9104
Container-title:Physics and Chemistry of Liquids
language:en
Short-container-title:Physics and Chemistry of Liquids

Author:

Mudry Stepan¹,Shtablavyi Ihor¹,Liudkevych Uliana¹

Affiliation:

1. Physics of Metals Department, Ivan Franko National University of Lviv, Lviv, Ukraine

Publisher

Informa UK Limited

Subject

Materials Chemistry,Physical and Theoretical Chemistry,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/00319104.2016.1198482

Reference30 articles.

1. Interfacial reactions between liquid indium and silver substrates

2. Gold-indium Transient Liquid Phase (TLP) wafer bonding for MEMS vacuum packaging

3. Wafer-Level Integration of High-Quality Bulk Piezoelectric Ceramics on Silicon

4. Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations

5. Dissolution process at solid/liquid interface in nanometric metallic multilayers: Molecular dynamics simulations versus diffusion modeling

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1. Temperature-induced gradual polymorphic structural crossover in liquid indium, tin, and antimony;Physical Review B;2024-01-26

2. Revealing mechanism of non-Arrhenius viscosity change in metal melts based on Wulff cluster model;Scripta Materialia;2023-09

3. Formation of nanoscale phases during rapid solidification of Al–Cu–Si alloys;Applied Nanoscience;2023-06-26

4. Short-Range Ordering Structure of the Cu2In Intermetallic Compound in the Precrystallization Temperature Range;Materials Science;2020-05

5. Short-range order structure and free volume distribution in liquid bismuth: X-ray diffraction and computer simulations studies;Philosophical Magazine;2020-04-27

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