Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: viscosity and surface tension-Reference-Cited by-同舟云学术

Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: viscosity and surface tension

Published:2017-11-13 Issue:1 Volume:98 Page:37-53
ISSN:1478-6435
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Dogan Ali¹,Arslan Hüseyin¹²^ORCID

Affiliation:

1. Department of Physics, Science and Art Faculty, Kahramanmaras Sutcuimam University, Kahramanmaras, Turkey

2. Department of Material Science and Engineering, Institute for Graduate Studies in Science and Technology, Kahramanmaras Sutcuimam University, Kahramanmaras, Turkey

Publisher

Informa UK Limited

Subject

Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/14786435.2017.1392053

Reference53 articles.

1. Lead-free Solders in Microelectronics

2. Interfacial reactions in the Sb–Sn/(Cu, Ni) systems: Wetting experiments

3. R. Wild,Properties of some low melting fusible alloys, IBM Federal Systems Division Laboratory Technical Report No 171200408, 1971.

4. Review of non-reactive and reactive wetting of liquids on surfaces

5. Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system

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