Recent Progress of Lead-free in Electronic Packaging-Reference-Cited by-同舟云学术

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Recent Progress of Lead-free in Electronic Packaging

Published:2005 Issue:6 Volume:48 Page:372-377
ISSN:0559-8516
Container-title:SHINKU
language:en
Short-container-title:SHINKU

Author:

TAKEMOTO Tadashi¹

Affiliation:

1. Joining and Welding Research Institute, Osaka University

Publisher

The Vacuum Society of Japan

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics

Link

https://www.jstage.jst.go.jp/article/jvsj/48/6/48_6_372/_pdf

Reference16 articles.

1. 1) R. J. Klein Wassink: Solering in Electronics, 2nd Ed., Electrochem. Pub., Scotland, (1989).

2. 3) Official Journal of the European Union, Feb. 13, (2003), L37/19-L37/23, L37/24-L37/38.

3. Lead-free Solder and Micro-joining.

4. Tensile Deformation Behavior of Sn-Ag-Bi System Lead-free Solders.

5. 9) Lead-Free Solder Project, Final Report: National Center for Manufacturing Science, Michigan, (1997).

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characteristics and Microstructural Development of Cold-Sprayed Copper Coating on Aluminum;MATERIALS TRANSACTIONS;2019-04-01

2. Microstructure of Interface between Sn-Cu Solder with Ni and Cu Plate;Journal of the Japan Institute of Metals;2006

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