[Paper] Investigation of Implantation Damage Recovery using Microwave Annealing for High Performance Image Sensing Devices
Author:
Affiliation:
1. Technology Division, Renesas Semiconductor Manufacturing Co.,Ltd.
2. Production Technology Development Unit, Renesas Electronics Corp.
Publisher
Institute of Image Information and Television Engineers
Subject
Computer Graphics and Computer-Aided Design,Media Technology,Signal Processing
Link
https://www.jstage.jst.go.jp/article/mta/4/2/4_85/_pdf
Reference8 articles.
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2. 2) T.L.Alford, D.C.Thompson, J.W.May er, N.David.Theodore: "Dopant activation in ion implanted silicon by microwave annealing", J.Applied Physics 106, 114902 (2009)
3. 3) Y.J.Lee: "Dopant Activation by Microwave Anneal", Proceeding of IEEE IWJT, pp.44-49 (2011)
4. 4) Peng Xu, Chaochao Fu, David Wei Zhang, Dongping Wu, Jun Luo, Chao Zhao, Zhi-Bin Zhang, Shi-Li Zhang: "Ultra-shallow junctions formed using microwave annealing", Applied Physics Letters, 102, 122114 (2013)
5. 5) T. Iwai, K.Eriguchi, S.Yamauchi, N.Noro, J.Kitagawa, K.Ono: "Low-temperature microwave repairing for plasma-induced local defect structures near Si substrate surface", Proceeding of International Symposium on Dry Process, pp.135-136 (2014)
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1. Reduction in number of crystal defects in a p+Si diffusion layer by germanium and boron cryogenic implantation combined with sub-melt laser spike annealing;Japanese Journal of Applied Physics;2017-08-22
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