Reactive ion etching of InP, InGaAs, InAlAs: Comparison of C2H6/H2 with CCl2F2/O2

Author:

Pearton S. J.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 60 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Parametric reactive ion etching of InP using Cl2and CH4gases: effects of H2and Ar addition;Semiconductor Science and Technology;2002-02-18

4. Photocapacitance of deep levels in GaP crystals surface treated by reactive ion etching;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2002

5. Characterization of high density CH4/H2/Ar plasmas for compound semiconductor etching;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1999-05

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