Studies of the interface between the epoxy molding compound and the copper leadframe by x‐ray photoelectron spectroscopy, Auger electron spectroscopy, and secondary electron microscopy-Reference-Cited by-同舟云学术

Studies of the interface between the epoxy molding compound and the copper leadframe by x‐ray photoelectron spectroscopy, Auger electron spectroscopy, and secondary electron microscopy

Published:1990-11 Issue:6 Volume:8 Page:4074-4078
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Pan F. M.,Horng S. R.,Yang T. D.,Tang V.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.576442

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