Etch products from the reaction on Cl2 with Al(100) and Cu(100) and XeF2 with W(111) and Nb-Reference-Cited by-同舟云学术

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Etch products from the reaction on Cl2 with Al(100) and Cu(100) and XeF2 with W(111) and Nb

Published:1985-01 Issue:1 Volume:3 Page:9
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:
Short-container-title:J. Vac. Sci. Technol. B

Author:

Winters Harold F.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 132 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Technical Optimization of Waferless Auto Clean for Aluminum Etcher;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

2. Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Interaction of Bromine with Cu(100) surface: adsorption and thermodynamics stability study;2023-04-11

4. Thermal Atomic Layer Etching of CoO, ZnO, Fe₂O₃, and NiO by Chlorination and Ligand Addition Using SO₂Cl₂ and Tetramethylethylenediamine;Chemistry of Materials;2023-02-20

5. Volatile Products from Ligand Addition of P(CH₃)₃ to NiCl₂, PdCl₂, and PtCl₂: Pathway for Metal Thermal Atomic Layer Etching;The Journal of Physical Chemistry C;2022-05-09

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