Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy-Reference-Cited by-同舟云学术

Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

Published:2015-11 Issue:6 Volume:33 Page:060611
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Devender ¹,Lofgreen Kelly²,Devasenathipathy Shankar²,Swan Johanna²,Mahajan Ravi²,Borca-Tasciuc Theodorian³,Ramanath Ganpati¹

Affiliation:

1. Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180

2. Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226

3. Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180

Funder

National Science Foundation (NSF)

Semiconductor Research Corporation (SRC)

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献