Author:
Neudeck Gerold W.,Pae Sangwoo,Denton John P.,Su Tai-chi
Cited by
27 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. References;Three-Dimensional Integrated Circuit Design;2017
2. A Cost Comparison of VLSI Integration Schemes;3-Dimensional VLSI;2010
3. Introduction;3-Dimensional VLSI;2010
4. References;Three-dimensional Integrated Circuit Design;2009
5. 3D Integration Technologies – An Overview;Materials for Advanced Packaging;2009