Si nanocone structure fabricated by a relatively high-pressure hydrogen plasma in the range of 3.3–27 kPa
Author:
Affiliation:
1. Department of Precision Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
2. Research Center for Precision Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka 565-0871, Japan
Abstract
Funder
Japan Society for the Promotion of Science
Kansai Research Foundation for Technology Promotion
Publisher
American Vacuum Society
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials
Link
https://avs.scitation.org/doi/pdf/10.1116/6.0001676
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2. Role of O2 and N2 addition on low-reflectance Si surface formation using moderate-pressure (3.3 kPa) hydrogen plasma;Physica Scripta;2023-10-13
3. Shallow defect layer formation as Cu gettering layer of ultra-thin Si chips using moderate-pressure (3.3 kPa) hydrogen plasma;Journal of Applied Physics;2023-04-24
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