Si nanocone structure fabricated by a relatively high-pressure hydrogen plasma in the range of 3.3–27 kPa

Author:

Nomura Toshimitsu1,Kimoto Kenta1,Kakiuchi Hiroaki1ORCID,Yasutake Kiyoshi12,Ohmi Hiromasa12ORCID

Affiliation:

1. Department of Precision Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan

2. Research Center for Precision Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka 565-0871, Japan

Abstract

In this study, we prepared a silicon nanocone structure using a relatively high-pressure H2 plasma in the range of 3.3–27 kPa. The silicon sample with the prepared nanocone structure exhibited a black surface. We investigated the dependence of the silicon nanocone formation behavior on various experimental parameters such as H2 pressure, processing time, substrate temperature, input power, and substrate bias. A small amount of air feed and a thin native oxide layer are desirable for the nanocone formation. Furthermore, the silicon temperature during plasma exposure plays an important role in increasing the silicon nanocone height. In addition, the polarity of the substrate bias drastically changes the surface structure from the nanocone in the case of a negative bias to a low-aspect-ratio pyramidal structure in that of a positive bias. This result implies that the anisotropic ion incidence is important for nanocone formation, despite the relatively high process pressure.

Funder

Japan Society for the Promotion of Science

Kansai Research Foundation for Technology Promotion

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

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