Forward bias degradation and thermal simulations of vertical geometry β-Ga2O3 Schottky rectifiers
Author:
Affiliation:
1. Department of Chemical Engineering, University of Florida, Gainesville, Florida 32611
2. US Naval Research Laboratories, Washington, DC 20375
3. Department of Material Science and Engineering, University of Florida, Gainesville, Florida 32611
Funder
Division of Materials Research
Office of Naval Research
Defense Threat Reduction Agency
Publisher
American Vacuum Society
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials
Link
http://avs.scitation.org/doi/am-pdf/10.1116/1.5127511
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1. Enhancement of heat dissipation in β-Ga2O3 Schottky diodes through Cu-filled thermal vias: experimental and simulation investigations;Journal of Materials Chemistry C;2024
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4. Degradation of β-Ga2O3 Vertical Ni/Au Schottky Diodes Under Forward Bias;IEEE Electron Device Letters;2023-05
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