Author:
Yiang K. Y.,Yoo W. J.,Krishnamoorthy Ahila
Cited by
4 articles.
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1. Influence of porosity on dielectric breakdown of ultralow-k dielectrics;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2013-09
2. Effect of energetic ions on plasma damage of porous SiCOH low-k materials;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-05
3. Effect of top power on a low-k film during oxygen strip in a TCP etch chamber;Microelectronic Engineering;2010-03
4. Plasma enhanced chemical vapor deposition of low dielectric constant SiOC(–H) films using MTES/O2 precursor;Thin Solid Films;2007-04