Subject
Electrical and Electronic Engineering,Condensed Matter Physics
Cited by
2 articles.
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1. Die singulation technologies for advanced packaging: A critical review;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-07
2. Microstructure and temperature coefficient of resistance of thin cermet resistor films deposited from CrSi2–Cr–SiC targets by S-gun magnetron;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2010-01