Void formation during silicidation and its influence on the thermal stability of cobalt silicide

Author:

Kim Nam-Sik,Cha Han-Seob,Sung Nag-Kyun,Ryu Hyuk-Hyun,Youn Ki-Seog,Lee Won-Gyu

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Quantitative Evaluation of Cobalt Disilicide/Si Interfacial Roughness;ECS Journal of Solid State Science and Technology;2017

2. Transmission Electron Microscope-Induced Structural Evolution in Amorphous Fe, Co, and Ni Oxide Nanoparticles;Langmuir;2008-06-10

3. Silicides;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09

4. CoSi[sub x] thermal stability on narrow-width polysilicon resistors;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006

5. Thermal stability study on nanoscale polysilicide resistors;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006

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