Effect of Process Parameters on Etch Depth of Aluminium Material in Photochemical Machining
Author:
Publisher
Springer Singapore
Link
http://link.springer.com/content/pdf/10.1007/978-981-15-9117-4_7
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4. Cakir O (2006) Copper etching with cupric chloride and regeneration of waste etchant. J Mater Process Tech 175(1–3):63–68. https://doi.org/10.1016/j.jmatprotec.2005.04.024
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