Preliminary Experimental Investigation into Work Brush Temperature on Silicon Wafer Using Single Pole Magnetic Abrasive Finishing (SPMAF)
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Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-97-3173-2_39
Reference9 articles.
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4. Piñeiro A, Black A, Medina J, Dieguez E, Parra V (2013) The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers. Wear 303(1–2):446–450. ISSN 0043-1648. https://doi.org/10.1016/j.wear.2013.03.030
5. Pandey K, Pandey PM (2017) Chemically assisted polishing of monocrystalline silicon wafer Si (100) by DDMAF. Procedia Eng 184:178–184. ISSN 1877-7058. https://doi.org/10.1016/j.proeng.2017.04.083
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